Wireless electronic-control system

ABSTRACT

Various embodiments include methods and apparatuses to test production tools and related electrical components therefor including individual printed-circuit boards (PCBs). In one example, a test-plug hardware-platform includes at least one input/output (I/O) connector, and a configurable control system to provide command and operational signals through the I/O connector and collect data through the I/O connector from at least one PCB under test. A wireless-mesh network within the test-plug hardware-platform can interface wirelessly with at least the PCB under test. The at least one PCB operating within a production tool or other piece of equipment. Other methods and systems are disclosed.

CLAIM OF PRIORITY

This application claims the priority benefit to U.S. Patent ApplicationSer. No. 62/770,587, filed on 21 Nov. 2018, and entitled “WIRELESSELECTRONIC-CONTROL SYSTEM,” which is incorporated by reference herein inits entirety.

TECHNICAL FIELD

The subject matter disclosed herein relates to testing of variousproduction tools used in the semiconductor and related industries. Morespecifically, the disclosed subject matter relates to a configurable“test plug” form factor input/output. (I/O) control board with purposesincluding quick system testing, diagnostics, and troubleshooting of oneor more production tools.

BACKGROUND

Various tools used in the semiconductor and related industries use anumber of different types of electronic-control system. Theseelectronic-control systems bridge the gap between software and thehardware used for substrate (e.g., silicon wafer) processing. Thevarious tools include, for example, process tools (such as etch tools,deposition tools, and cleaning tools), metrology tools (such assubstrate scanners and various types of inspection tools), and othertypes of tools used in the used in the semiconductor and relatedindustries. This variety of tools is simply referred to as “productiontools” herein for brevity, although various types of related researchand development (R&D) and other off-line and in-situ tools are includedas a part of the term “production tool” as well.

For each production tool, custom printed-circuit boards (PCBs) aredeveloped to support routing of signals from I/O controllers, safetyinterlock devices, power distribution, support circuitry for externaldevices, and other functions. In addition, there are normally multipleversions of each custom PCB developed due to changes in specificationsof the tools, problems fixed (necessitating a new PCB), etc.

The normal process for a controls group when a new PCB is ordered andreceived is to manually bench test and verify the functionality of theentire PCB. Depending on the complexity of the PCB, the testingprocedure may take one or more engineers anywhere from an hour toseveral days to complete.

Contemporaneous testing includes manually moving jumpers betweenconnectors on the PCBs to read or activate an I/O as shown in FIG. 1A.For example, FIG. 1A shows a first node 110 (node 0), a second node 120(node 1), and a third node 130 (node 2). Each of these nodes is used toconnect to various ports on a PCB manually. More or fewer nodes may beneeded depending an a level of complexity of a connected PCB. The higherthe number of nodes, the more complexity in wiring to the PCB and themore possibility of errors in making connections. Further, as notedabove, many tools have safety-interlock devices that must also be testedfor proper functionality. Safety-interlock devices are generallyprogrammable and therefore quickly updated. However, thesafety-interlock devices often require manual jumper-based testing afterevery change.

FIG. 1B shows custom test plugs 150 produced by a manufacturer of PCBsto test specific nodes of a tool. However, these custom test plugs areexpensive. Significantly, these custom test plugs provide no automatedtesting capabilities, so all tests must be run manually. Also, once aPCB or tool is modified, a new test plug must be constructed andprovided by the manufacturer.

FIG. 1C shows one test platform 170 that uses existing I/O controllers(IO Cont. Node 0, IO Cont. Node 1, . . . IO Cont. Node x) to testvarious nodes. However, for each tool, one or more custom PCBs and/orcables must be constructed to connect the system to various test nodes(Test IO Cont. Node x . . . Test IO Cont. Node 1, Test IO Cont. Node 0).Therefore, the test platform of FIG. 1C still requires custom-made PCBsfor every type of I/O controller used in a tool.

In addition to hardware verification, software has to be developed andtested. Much of the software development is done with simulated I/O.Simulation of the IO allows the software developer to test many aspectsof the software but does not allow for testing of the low-levelcommunication required when communicating with hardware. Many newproblems are often discovered by the software developers once they getaccess to the real hardware and they are no longer simulating I/O of thetool. Testing an actual tool can result in delays to system integrationand the rest of the project since much of this testing has to wait untilthe tool is built. Moreover, current software-simulation models cannotalways be programmed to capture actual problems encountered by the toolssuch as system lockups and substrate breakage scenarios. When thesoftware is run on the actual tool, the tool is taken out-of-productionand can shut down an entire process line (if already installed in afabrication facility). Also, the software testing often requires thescrapping of test substrates or, in the case of deposition tools, awaste of expensive precursor gases and/or precursor liquids.

The information described in this section is provided to offer theskilled artisan a context for the following disclosed subject matter andshould not be considered as admitted prior art.

BRIEF DESCRIPTION OF THE FIGURES

FIGS. 1A-1C show examples of various types of hardware and/or softwaretest systems currently in use:

FIG. 2 shows an exemplary embodiment of a configurable test-plughardware-platform, according to various exemplary embodiments;

FIG. 3 shows an exemplary embodiment of a wireless mesh network that canbe used with the disclosed subject matter, according to variousexemplary embodiments;

FIG. 4 shows an exemplary embodiment of an implementation of thetest-plug hardware-platform when used with, for example, a productiontool, according to various exemplary embodiments; and

FIG. 5 shows a simplified block diagram of a machine in an example formof a computing system within which a set of instructions for causing themachine to perform any one or more of the methodologies and operationsdiscussed herein may be executed.

DETAILED DESCRIPTION

The disclosed subject matter will now be described in detail withreference to a few general and specific embodiments as illustrated invarious ones of the accompanying drawings. In the following description,numerous specific details are set forth in order to provide a thoroughunderstanding of the disclosed subject matter. It will be apparent,however, to one skilled in the art, that the disclosed subject mattermay be practiced without some or all of these specific details. In otherinstances, well-known process steps or structures have not beendescribed in detail so as not to obscure the disclosed subject matter.

The disclosed subject matter contained herein described relatesgenerally to operations and testing of production tools and electricalcomponents thereof. Such production tools can include various types ofdeposition (including plasma-based tools such as atomic layer deposition(ALD), chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), andso on, as well as etching tools (e.g., reactive-ion etching (RIE)tools), and various types of thermal furnaces (e.g., such as rapidthermal annealing (RTA) and oxidation), ion implantation, and a varietyof other process and metrology tools found in various fabs and known toa person of ordinary skill in the art. However, the disclosed subjectmatter is not limited to semiconductor environments and can be used in anumber of machine-tool environments such as robotic assembly,manufacturing, and machining environments.

For ease in understanding the disclosed subject matter, various exampleswill be provided with reference to a semiconductor fabricationproduction tool. However, upon reading and understanding the disclosureprovided herein, the person of ordinary skill in the art will recognizethat various embodiments of the test-plug hardware-platform of thepresent disclosure can be used in a wide variety of environments wherevarious types of tool or tools are used.

In general, various embodiments of the disclosed subject matter comprisea configurable “test plug” form factor input/output (I/O) control boardthat can be used for, for example, quick system testing, diagnostics,and troubleshooting of production tools and associated printed-circuitboards (PCBs) and other electrical components.

Therefore, the disclosed subject matter provides a way to test quicklyand substantially simultaneously the functionality of every standard andcustom PCB developed for, for example, a production tool. With variousembodiments of the disclosed subject matter, in order to test one ormore PCBs on a production tool, a test plug is coupled from one or moreof the test-plug hardware-platforms described herein to each connectoron the PCB. The test engineer then uses software to configure the testplug I/O and perform tests as needed. Once configuration is complete,the engineer can start the automated testing. The configuration can besaved for faster testing of other similar or identical PCBs if needed inthe future.

Once set up, multiple PCBs of the same type (or even a similar type withmodifications as needed) can also be tested quickly and substantiallysimultaneously. Further, software will be able to test low-levelcommunication with actual (as opposed to simulated) hardware (e.g., tothe PCB while still mounted within the production tool). The testengineer can use the software to do this testing on the bench and solveproblems before system integration. Therefore, the subject matterdisclosed herein describes a configurable and flexible test-plughardware-platform, comprising an I/O board and wireless electroniccontrol system as described herein. Further, each of the arrangementsand configurations of various embodiments of the test-plughardware-platform is defined in greater detail below.

For example, with reference now to FIG. 2, an example of a configurabletest-plug hardware-platform 200 (a configurable control systemincluding, for example, at least one input/output (I/O) connector and awireless-mesh network) according to various exemplary embodiments isshown. Computer software may be used to monitor inputs and commandoutputs on the test-plug hardware-platform, as described in more detailbelow. A configuration of the computer software may be based on anexisting signal list and interlock table for a particular productiontool. In various embodiments, the signal list and interlock tables maybe directly imported into the software from a predefined table. Asoftware-based user interface (UI) allows for I/O status checking andmanipulation. The UI can also run automated I/O tests to verify thefunctionality of the hardware being tested. Overall, the test-plughardware-platform 200 can be used for quick system-testing,system-diagnostics, and troubleshooting of various PCBs for a productiontool or the production tool itself. The test-plug hardware-platform 200therefore provides a robust, reliable, and quickly configurablediagnostic and validation system for a production tool and relatedelectrical components.

Although the configurable test-plug hardware-platform 200 of FIG. 2shows only a single male connector 210 and a single female connector 230to avoid obfuscating the disclosed subject matter, in variousembodiments, the test-plug hardware-platform 200 can include any numberof male and female connectors. Also, the single male connector 210 andthe single female connector 230 may be reversed in orientation comparedwith the orientation shown in FIG. 2.

For example, in various embodiments, the test-plug hardware-platform 200can include multiple types of common electrical-connector types such asD-type subminiature (“DSUB”) electrical connectors to interface withvarious ones of the electrical PCBs and other electrical componentsfound on a production tool. DSUB electrical connectors are known to aperson of ordinary skill in the art and include, for example, DA-15connectors, DB-25 connectors, DC-37 connectors, DD-50 connectors, DE-9connectors, DB13W3 connectors, and a number of other electricalconnector types used in the industry. Such connectors can supportvarious 9-, 15-, 25-, 37-, and 50-pin standard density DSUB1 connectorsas well as 15-, 26-, 44-, 62-, and 78-pin high-density DSUB connectors.Additionally, certain types of DSUB connectors may also include, forexample, coaxial connectors used to support high frequency devices(e.g., RF devices) and video-signal connections.

Additionally, in various embodiments, the test-plug hardware-platform200 can include other common electrical-connector types such as IEEE1394 (FireWire®), Thunderbolt®, Universal Serial Bus (USB®), and otherconnector types known in the art. The test-plug hardware-platform 200can also include various types of relays, opto-couplers, safetyinterlocks, and other electrical components. These other electricalcomponents may also be configurable by software.

Regardless of the type of electrical connector used, each of the pins onall of the electrical connectors are separately configurable, viasoftware (and/or hardware in certain configurations), such as supplyingor receiving power, ground, various types of analog and digital signals(e.g., AI, AO, DI, or DO) and various other types of signals known inthe art (e.g., video signals for various types of metrology tools), withall tested substantially simultaneously.

Consequently, the test-plug hardware-platform 200 can readily beconfigured to work with a number of different types of production tools(and related PCBs and other electrical components) without the laboriousrewiring (including breadboarding and other techniques involving the useof jumper wires for electrical reconnections as shown in FIG. 1A), orthe fabrication of tool-specific boards for a particular production toolonly (as shown in FIG. 1B), as are used under the prior art. Therefore,various embodiments of the test-plug hardware-platform 200 allows thetesting of, for example, input output controller (IOC) outputs (e.g.,AO, DO) that may be mapped, via software, to inputs of the test-plughardware-platform 200 (e.g., AI, DI). Similarly, IOC inputs (e.g., AI,DI) may be mapped, via software, to outputs of the test-plughardware-platform 200 (e.g., AO, DO). Special IO-like contact closurescan be tested with a combination of outputs and inputs as will berecognizable to a person of ordinary skill in the art upon reading andunderstanding the disclosure provided herein.

With continuing reference to FIG. 2, various embodiments of thetest-plug hardware-platform 200 may also include universal I/O circuitry201, one or more programmable logic devices (PLDs) 203 to buildreconfigurable digital circuits, one or more microcontroller units(MCUs) 205 used to, for example, manipulate, correlate, or direct datareceived from or sent to a production tool (or save to a memory device(not shown)), a radio source 207 (including, for example, Bluetooth® orother wireless devices described below) to receive or transmit data toand from the production tool or other external devices, a number of LEDand/or LCD buttons 209 (which may include various displays, readouts,etc.) and a number of other types of electrical-connector supportcircuitry as is known in the art. In various embodiments, the radiosource 207 can be used to interface with a wireless-mesh network, asdescribed in more detail below with reference to FIG. 3. FIG. 2 is alsoshown to include a number of 24 V connections 221. The skilled artisanwill readily recognize that the 24 V level is stated merely forconvenience in understanding. Various voltages, higher or lower than 24V, may of course be included instead of or in addition to the 24 Vconnections.

The test-plug hardware-platform 200 may be powered from IOC or varioustypes of either internal power circuitry 220 and/or externalpower-supplies (not shown) as needed. As shown in FIG. 2, variousembodiments of the test-plug hardware-platform 200 can include variousvoltage levels (e.g., 24 volts) of power connections and groundconnections. These power and ground connections may be jumped manuallyor configured via, for example, software within, for example, a 24 Vpower and ground jumper module 211. Additionally, the test-plughardware-platform 200 of FIG. 2 is shown to include onboard power andpower management devices such as a lithium-polymer battery and/or othertypes of battery and DC-to-DC conversion circuits known in the art.

FIG. 3 shows an example of a wireless-mesh network 300 that can be usedwith the disclosed subject matter, according to various exemplaryembodiments. The wireless-mesh network 300 can eliminate numerousinterconnecting cables and jumpers. Further, the wireless mesh networkprovides for communications between various test-plug hardware-platformsas well as wireless communications with the production tool (or relatedcomponents thereof) under test. Additionally, a USB® communicationsdevice can be used to interface the wireless-mesh network with acomputer (e.g., a laptop or tablet computer).

In various embodiments, the wireless-mesh network 300 can utilize anumber of different communications standards, host interfaces, andprotocols, such as, for example, IEEE 802.15.4, Zigbee®, XBee®,Bluetooth®, and other wireless communications standards and protocols.These standards and protocols, and others, specify various factors suchas a physical layer and access control for low-rate wireless networks.

Referring now to FIG. 4, an example of an exemplary embodiment of atest-plug hardware-platform 400 when used with a production tool (orrelated electrical component, neither of which is shown explicitly butwould be well understood to a skilled artisan upon reading andunderstanding the as-filed Application), according to various exemplaryembodiments, is shown. The test-plug hardware-platform 400 may be thesame as or similar to the test-plug hardware-platform 200 of FIG. 2.

In a specific exemplary implementation, a number of test-plughardware-platforms are coupled to a number of nodes, Node 0 405A. Node1, 405B, . . . Node X 405X. Each node is labeled as “IO ControllerNode,” which is a specific hardware platform that can run, for example,an Ethernet for Control Automation Technology (EtherCAT®) protocolsoftware and/or firmware and that adheres to EtherCAT® standards asdeveloped under IEEE 802 standards. However, any type of wireless typeor wired type of node known in the art could be used.

The nodes are electrically and communicatively coupled to (e.g.,hardwired or wirelessly coupled), for example, an Ethernet switch 403(ENET Switch) or an EtherCAT® or ECAT junction box. The ENET Switch 403is coupled to a test computer 401, which may comprise, for example, asingle-board computer (SBC), or other type of MCU or even a laptopcomputer or tablet computer. The test computer 401 can be used for anumber of different purposes as described herein including memorystorage and controlling or programming various I/O protocols. In otherembodiments, the test computer may also be running a number of simulateddevices while actual I/O from the production tool or tools (not shown)is monitored.

In this specific exemplary embodiment, the test computer 401 may beelectrically and communicatively coupled to various types of productiontools or related types of equipment (not shown). However, the testcomputer 401 could be coupled directly to, for example, PCBs or othercomponents within a production tool or multiple production tools (notshown). Either the test computer 401 or the production tool may also bein direct wireless communication with the test-plug hardware-platformsthrough the wireless-mesh network 300 of FIG. 3. In turn, thewireless-mesh network 300 can manage an entire network of test-plughardware-platforms as needed.

Overall, upon reading and understanding the disclosure provided herein,a person of ordinary skill in the art will recognize that significantadvantages of the various embodiments of the test-plug hardware-platformdisclosed herein include saving time and saving money. For example,automating testing saves significant time for production tooldiagnostics and testing. Further, software testing benefits as well bysaving time with hardware-interface testing. Moreover, software testingcan be completed before a production tool is built such that integrationgoes more smoothly and either does not impact or limits impact of aproject schedule.

Throughout this specification, plural instances may implementcomponents, operations, or structures described as a single instance.Although individual operations of one or more methods are illustratedand described as separate operations, one or more of the individualoperations may be performed concurrently, and nothing requires that theoperations be performed in the order illustrated. Structures andfunctionality presented as separate components in example configurationsmay be implemented as a combined structure or component. Similarly,structures and functionality presented as a single component may beimplemented as separate components. These and other variations,modifications, additions, and improvements fall within the scope of thesubject matter herein.

Certain embodiments are described herein as including logic devices or anumber of components, modules, or mechanisms. Modules may constituteeither software modules (e.g., code embodied on a machine-readablemedium or in a transmission signal) or hardware modules. A “hardwaremodule” is a tangible unit capable of performing certain operations andmay be configured or arranged in a certain physical manner. In variousembodiments, one or more computer systems (e.g., a standalonecomputer-system, a client computer-system, or a server computer-system)or one or more hardware modules of a computer system (e.g., a processoror a group of processors) may be configured by software (e.g., anapplication or application portion) as a hardware module that operatesto perform certain operations as described herein.

In some embodiments, a hardware module may be implemented mechanically,electronically, or any suitable combination thereof. For example, ahardware module may include dedicated circuitry or logic that ispermanently configured to perform certain operations. For example, ahardware module may be a special-purpose processor, such as a fieldprogrammable gate array (FPGA) or an Application-Specific IntegratedCircuit (ASIC). A hardware module may also include programmable logic orcircuitry that is temporarily configured by software to perform certainoperations. For example, a hardware module may include softwareencompassed within a general-purpose processor or other programmableprocessor. It will be appreciated that the decision to implement ahardware module mechanically, in dedicated and permanently configuredcircuitry, or in temporarily configured circuitry (e.g., configured bysoftware) may be driven by cost and time considerations.

Accordingly, the phrase “hardware module” should be understood toencompass a tangible entity, be that an entity that is physicallyconstructed, permanently configured (e.g., hardwired), or temporarilyconfigured (e.g., programmed) to operate in a certain manner or toperform certain operations described herein. As used herein,“hardware-implemented module” refers to a hardware module. Consideringembodiments in which hardware modules are temporarily configured (e.g.,programmed), each of the hardware modules need not be configured orinstantiated at any one instance in time. For example, where a hardwaremodule comprises a general-purpose processor configured by software tobecome a special-purpose processor, the general-purpose processor may beconfigured as respectively different special-purpose processors (e.g.,comprising different hardware modules) at different times. Software mayaccordingly configure a processor or other configurable device, forexample, to constitute a particular hardware-module at one instance oftime and to constitute a different hardware module at a differentinstance of time. Additionally, the software may be used to programfirmware.

Hardware modules can provide information to, and receive informationfrom, other hardware modules. Accordingly, the described hardwaremodules may be regarded as being communicatively coupled. Where multiplehardware modules exist contemporaneously, communications may be achievedthrough signal transmission (e.g., over appropriate circuits and buses)between or among two or more of the hardware modules. In embodiments inwhich multiple hardware modules are configured or instantiated atdifferent times, communications between such hardware modules may beachieved, for example, through the storage and retrieval of informationin memory structures to which the multiple hardware modules have access.For example, one hardware module may perform an operation and store theoutput of that operation in a memory device to which it iscommunicatively coupled. A further hardware module may then, at a latertime, access the memory device to retrieve and process the storedoutput. Hardware modules may also initiate communications with input oroutput devices, and can operate on a resource (e.g., a collection ofinformation).

The various operations of example methods described herein may beperformed, at least partially, by one or more processors that aretemporarily configured (e.g., by software) or permanently configured toperform the relevant operations. Whether temporarily or permanentlyconfigured, such processors may constitute processor-implemented modulesthat operate to perform one or more operations or functions describedherein. As used herein, “processor-implemented module” refers to ahardware module implemented using one or more processors or otherconfigurable components (e.g., such as an FPGA, and ASIC, firmware, ofcomponents of the test-plug hardware-platform itself).

Similarly, the methods described herein may be at least partiallyprocessor-implemented, a processor being an example of hardware. Forexample, at least some of the operations of a method may be performed byone or more processors or processor-implemented modules. Moreover, theone or more processors may also operate to support performance of therelevant operations in a “cloud computing” environment or as a “softwareas a service” (SaaS). For example, at least some of the operations maybe performed by a group of computers (as examples of machines includingprocessors), with these operations being accessible via a network (e.g.,the Internet) and via one or more appropriate interfaces (e.g., anapplication program interface (API)).

The performance of certain of the operations may be distributed amongthe one or more processors, not only residing within a single machine,but deployed across a number of machines. In some embodiments, the oneor more processors or processor-implemented modules may be located in asingle geographic location (e.g., within a home environment, an officeenvironment, or a server farm). In other embodiments, the one or moreprocessors or processor-implemented modules may be distributed across anumber of geographic locations.

FIG. 5 is a block diagram illustrating components of a machine 500,according to some embodiments, able to read instructions from amachine-readable medium e.g., a non-transitory machine-readable medium,a machine-readable storage medium, a computer-readable storage medium,or any suitable combination thereof) and perform any one or more of themethodologies discussed herein. Specifically, FIG. 5 shows adiagrammatic representation of the machine 500 in the example form of acomputer system and within which instructions 524 (e.g., software, aprogram, an application, an applet, an app, or other executable code)for causing the machine 500 to perform any one or more of themethodologies discussed herein may be executed.

In alternative embodiments, the machine 500 operates as a standalonedevice or may be connected (e.g., networked) to other machines. In anetworked deployment, the machine 500 may operate in the capacity of aserver machine or a client machine in a server-client networkenvironment, or as a peer machine in a peer-to-peer (or distributed)network environment. The machine 500 may be a server computer, a clientcomputer, a personal computer (PC), a tablet computer, a laptopcomputer, a netbook, a set-top box (STB), a personal digital assistant(PDA), a cellular telephone, a smartphone, a web appliance, a networkrouter, a network switch, a network bridge, or any machine capable ofexecuting the instructions 524, sequentially or otherwise, that specifyactions to be taken by that machine. Further, while only a singlemachine is illustrated, the term “machine” shall also be taken toinclude a collection of machines that individually or jointly executethe instructions 524 to perform any one or more of the methodologiesdiscussed herein.

The machine 500 includes a processor 502 (e.g., a central processingunit (CPU), a graphics processing unit (GPU), a digital signal processor(DSP), an application specific integrated circuit (ASIC), aradio-frequency integrated circuit (RFIC), or any suitable combinationthereof), a main memory 504, and a static memory 506, which areconfigured to communicate with each other via a bus 508. The processor502 may contain microcircuits that are configurable, temporarily orpermanently, by some or all of the instructions 524 such that theprocessor 502 is configurable to perform any one or more of themethodologies described herein, in whole or in part. For example, a setof one or more microcircuits of the processor 502 may be configurable toexecute one or more modules (e.g., software modules) described herein.

The machine 500 may further include a graphics display 510 (e.g., aplasma display panel (PDP), a light emitting diode (LED) display, aliquid crystal display (LCD), a projector, or a cathode ray tube (CRT)).The machine 500 may also include an alpha-numeric input device 512(e.g., a keyboard), a cursor control device 514 (e.g., a mouse, atouchpad, a trackball, a joystick, a motion sensor, or other pointinginstrument), a storage unit 516, a signal generation device 518 (e.g., aspeaker), and a network interface device 520.

The storage unit 516 includes a machine-readable medium 522 (e.g., atangible and/or non-transitory machine-readable storage medium) on whichis stored the instructions 524 embodying any one or more of themethodologies or functions described herein. The instructions 524 mayalso reside, completely or at least partially, within the main memory504, within the processor 502 (e.g., within the processor's cachememory), or both, during execution thereof by the machine 500.Accordingly, the main memory 504 and the processor 502 may be consideredas machine-readable media (e.g., tangible and/or non-transitorymachine-readable media). The instructions 524 may be transmitted orreceived over a network 526 via the network interface device 520. Forexample, the network interface device 520 may communicate theinstructions 524 using any one or more transfer protocols (e.g.,hypertext transfer protocol

In some embodiments, the machine 500 may be a portable computing device,such as a smart phone or tablet computer, and have one or moreadditional input components (e.g., sensors or gauges). Examples of suchadditional input components include an image input component (e.g., oneor more cameras), an audio input component (e.g., a microphone), adirection input component (e.g., a compass), a location input component(e.g., a global positioning system (GPS) receiver), an orientationcomponent (e.g., a gyroscope), a motion detection component (e.g., oneor more accelerometers), an altitude detection component (e.g., analtimeter), and a gas detection component (e.g., a gas sensor). Inputsharvested by any one or more of these input components may be accessibleand available for use by any of the modules described herein.

As used herein, the term “memory” refers to a machine-readable mediumable to store data temporarily or permanently and may be taken toinclude, but not be limited to, random-access memory (RAM), read-onlymemory (ROM), buffer memory, flash memory, and cache memory. While themachine-readable medium 522 is shown in an embodiment to be a singlemedium, the term “machine-readable medium” should be taken to include asingle medium or multiple media (e.g., a centralized or distributeddatabase, or associated caches and servers) able to store instructions.The term “machine-readable medium” shall also be taken to include anymedium, or combination of multiple media, that is capable of storinginstructions for execution by a machine (e.g., the machine 500), suchthat the instructions, when executed by one or more processors of themachine (e.g., the processor 502), cause the machine to perform any oneor more of the methodologies described herein. Accordingly, a“machine-readable medium” refers to a single storage apparatus ordevice, as well as “cloud-based” storage systems or storage networksthat include multiple storage apparatus or devices. The term“machine-readable medium” shall accordingly be taken to include, but notbe limited to, one or more tangible (e.g., non-transitory) datarepositories in the form of a solid-state memory, an optical medium, amagnetic medium, or any suitable combination thereof.

Furthermore, the machine-readable medium is non-transitory in that itdoes not embody a propagating signal. However, labeling the tangiblemachine-readable medium as “non-transitory” should not be construed tomean that the medium is incapable of movement—the medium should beconsidered as being transportable from one physical location to another.Additionally, since the machine-readable medium is tangible, the mediummay be considered to be a machine-readable device.

The instructions 524 may further be transmitted or received over anetwork 526 (e.g., a communications network) using a transmission mediumvia the network interface device 520 and utilizing any one of a numberof well-known transfer protocols (e.g., HTTP). Examples of communicationnetworks include a local area network (LAN), a wide area network (WAN),the Internet, mobile telephone networks, POTS networks, and wirelessdata networks (e.g., WiFi and WiMAX networks). The term “transmissionmedium” shall be taken to include any intangible medium that is capableof storing, encoding, or carrying instructions for execution by themachine, and includes digital or analog communications signals or otherintangible medium to facilitate communication of such software.

As used herein, the term “or” may be construed in an inclusive orexclusive sense. Further, other embodiments will be understood by aperson of ordinary skill in the art upon reading and understanding thedisclosure provided. Further, upon reading and understanding thedisclosure provided herein, the person of ordinary skill in the art willreadily understand that various combinations of the techniques andexamples provided herein may all be applied in various combinations.

Although various embodiments are discussed separately, these separateembodiments are not intended to be considered as independent techniquesor designs. As indicated above, each of the various portions may beinter-related and each may be used separately or in combination withother test-plug hardware-platform discussed herein. For example,although various embodiments of methods, operations, and processes havebeen described, these methods, operations, and processes may be usedeither separately or in various combinations.

Consequently, many modifications and variations can be made, as will beapparent to a person of ordinary skill in the art upon reading andunderstanding the disclosure provided herein. Functionally equivalentmethods and devices within the scope of the disclosure, in addition tothose enumerated herein, will be apparent to the skilled artisan fromthe foregoing descriptions. Portions and features of some embodimentsmay be included in, or substituted for, those of others. Suchmodifications and variations are intended to fall within a scope of theappended claims. Therefore, the present disclosure is to be limited onlyby the terms of the appended claims, along with the full scope ofequivalents to which such claims are entitled. It is also to beunderstood that the terminology used herein is for the purpose ofdescribing particular embodiments only and is not intended to belimiting.

The Abstract of the Disclosure is provided to allow the reader toquickly ascertain the nature of the technical disclosure. The abstractis submitted with the understanding that it will not be used tointerpret or limit the claims. In addition, in the foregoing DetailedDescription, it may be seen that various features may be groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted aslimiting the claims. Thus, the following claims are hereby incorporatedinto the Detailed Description, with each claim standing on its own as aseparate embodiment.

1. A test-plug hardware-platform, comprising: at least one input/output(I/O) connector; a configurable control system to provide command andoperational signals through the I/O connector, the control systemfurther to collect data through the I/O connector from at least oneelectrical component under test, the at least one electrical componentconfigured to generate and receive a plurality of signals selected fromsignals including digital signals and analog signals; and awireless-mesh network configured within the test-plug hardware-platformto interface wirelessly with at least the at least one electricalcomponent under test.
 2. The test-plug hardware-platform of claim 1,wherein the configurable control system is configured to capture actualinput/output signals to and from the at least one electrical componentunder test.
 3. The test-plug hardware-platform of claim 1, wherein theconfigurable control system further comprises universal I/O circuitry tointerface with the at least one I/O connector, one or more programmablelogic devices (PLDs) to build reconfigurable digital circuits, one ormore microcontroller units (MCUs) to direct data received from and sentto the at least one electrical component, and a radio source.
 4. Thetest-plug hardware-platform of claim 1, wherein the radio source isconfigured to operate under at least one communications standard.
 5. Thetest-plug hardware-platform of claim 4, wherein the communicationsstandard includes at least one standard protocol selected from IEEE802.15.4, Zigbee®, XBee®, and Bluetooth®.
 6. The test-plughardware-platform of claim 1, wherein the configurable control system isconfigured to test substantially simultaneously the functionality of allinputs and outputs of the at least one electrical component.
 7. Thetest-plug hardware-platform of claim 1, wherein the configurable controlsystem is configured to test each connector on the at least oneelectrical component via software within the test-plughardware-platform.
 8. The test-plug hardware-platform of claim 1,wherein the at least one electrical component is operating within aproduction tool.
 9. The test-plug hardware-platform of claim 1, whereinthe test-plug hardware-platform is configured to test multiple ones ofthe at least one electrical component within a production toolsubstantially simultaneously.
 10. The test-plug hardware-platform ofclaim 1, wherein the test-plug hardware-platform is configured to testanalog signals and digital signals substantially simultaneously.
 11. Thetest-plug hardware-platform of claim 10, wherein at least one of theanalog signals and digital signals include video signals.
 12. Thetest-plug hardware-platform of claim 1, wherein the test-plughardware-platform is configured to supply power to the at least oneelectrical component.
 13. The test-plug hardware-platform of claim 1,wherein the test plug is configured to test low-level communication withthe at least one electrical component connected to the actual hardwarein which each of the at least one PCB electrical component is located.14. The test-plug hardware-platform of claim 1, wherein configuration ofsoftware within the configurable control system includes an existingsignal list and an interlock table for a particular tool in which the atleast one electrical component is located.
 15. A test-plughardware-platform, comprising: at least one input/output (I/O)connector; and a configurable control system to provide command andoperational signals through the I/O connector, the control systemfurther to capture actual input/output signals to and from at least oneelectrical component under test, the at least one electrical componentconfigured to generate and receive a plurality of signals selected fromsignals including digital signals and analog signals, the at least oneelectrical component being operated within a production tool.
 16. Thetest-plug hardware-platform of claim 15, further comprising a wirelesselectronic control system and a wireless-mesh network to interfacewirelessly with the at least electrical component under test.
 17. Thetest-plug hardware-platform of claim 15, wherein the test-plughardware-platform further comprises power and ground connections tosupply to the at least one electrical component, the power and groundconnections being configurable as an output to the at least one I/Oconnector via software.
 18. The test-plug hardware-platform of claim 15,further comprising a test computer, the test computer being configuredto: run a number of simulated devices; and monitor actual I/O from theeach of the at least one electrical component.
 19. A test-plughardware-platform, comprising: a wireless electronic control system; anda configurable control system to provide command and operational signalsthrough the wireless electronic control system, the control systemfurther to collect data through the wireless electronic control systemfrom at least one electrical component under test, the at least oneelectrical component configured to generate and receive a plurality ofsignals selected from signals including digital signals and analogsignals the control system further to capture actual input/outputsignals to and from the at least PG-one electrical component under testwith the at least one electrical component being operated within aproduction tool.
 20. A test-plug hardware-platform, wherein the wirelesselectronic control system is configured to provide communicationsbetween test-plug hardware-platform via wireless communications with theproduction tool.